Mounts / Carriers
Outline
Any type of carriers from C-mount to full-customized carriers can be manufactured according to the customers’ requirements. Our “ Cross-edge ” technology including cutting, plating, vapor deposition, and bonding, gives you a one-stop solution.
Features
Standard dimensions
Materials
| Body | Cu（OFHC）/CuW10 |
| Lead | Kv |
| Ceramic | Al203（92-96%） |
| Note: OFHC | Oxygen-free high thermal conductivity |
Dimension/Tolerance
| Length | upon request (Refer to A to L in the right figure) |
| Width | |
| Thickness | |
| Surface roughness | Ra<0.4 |
| Burr | 5μm以下 |
| Edge Radius | ①10μm以下 ②50μm以下 ③80μm以下 |
Metallization
| All surface | Ni 1-5μm/Au 0.1-0.3μm |
Options
AuSn vapor deposition
Diamond turning process (only for Cu type)
Note: These are standard specifications.
In case you have any request other than the above, please feel free to contact us.
Dimensions image（unit：mm）
End user market / Applications
Industrial laser
- Laser equipment for welding, cutting, marking,
surface treatment(e.g. annealing), etc - Medical laser equipment for ophthalmology and epilation, and endoscopes,etc
Optical communication
- Transmitters, Optical transceivers, Optical amplifiers (for pumping),etc
Digital equipment
- Laser printers, Digital multifunction-printers,etc