Supports design and manufacturing with our "Cross-edge" technology

  1. 株式会社テクニスコ
  2. TECNISCO,LTD.
  3. About "Cross-edge" technology
  4. Cutting/Grinding/Polishing

Cutting/Grinding/Polishing

Burr-less/sharp edge metal processing

Burr-less/sharp edge processing for cutting-resistant metals such as CuW, Kovar, Cu is available.

  • Sharp edge: 5 μm radius max. (Au plating is available)
  • Surface roughness (actual measurement average) : Ra 0.38 μm
CuW submounts(Standard product size)
Length(±0.05) Width(±0.05) Widt(±0.02)
10.6 2.0 0.20
0.25
0.30
0.40
3.0
4.0
5.6 5.6

CuW submounts(Standard product size)

Side view of CuW submounts (3 pieces) and its enlarged view

Side view of CuW submounts (3 pieces) and its enlarged view

CuW submounts Large
Front view

Front view

Products processed by this technology

Microchannel cooler

Microchannel cooler

CuW submounts

CuW submounts

Insulation type Cu-AlN-Cu submounts

Insulation type Cu-AlN-Cu submounts

High pressure seamless microchannels

High pressure seamless
microchannels

Mounts / Carriers

Mounts / Carriers

No chipping glass processing

Lots of chipping in tens of μm can occur on hard glasses such as borosilicate glass when they are drilled or grooved, causing quality problems. Our no chipping glass processing technologies can prevent chipping size less than ten μm when the glass wafers are used with a silicon wafer in the wafer level packaging (WLP) process or diced into elements. Moreover, post-treatment can eliminate all chipping.

Conventional dicing

Chipping: 0.03 mm max.X

Chipping: 0.03 mm max.

Chipping: 0.04 mm max.

Chipping: 0.04 mm max.

No chipping dicing

Chipping: 0.01 mm max.

Chipping: 0.01 mm max.

Chipping: 0.01 mm max.

Chipping: 0.01 mm max.

Products processed by this technology

Through glass via (TGV)

Through glass via (TGV)

Micro-hole glass

Micro-hole glass

Microfluidic glass

Microfluidic glass

Cavity glass/Cap glass

Cavity glass/Cap glass

Spacer glass

Spacer glass

Microhole processing

Drilling

  • We develop special drills for glass processing, and can process micro holes of ø0.2 mm for mass production and ø0.05 mm for trial manufacture.
  • It is possible to process rectangular cavity.

Micro through hole processing

Micro through hole processing

Microgroove processing

Microgroove processing

Cross section of microgroove processing

Cross section of microgroove processing

Sandblasting

  • Flexible pattern processing is available at a lower cost.
  • High cumulative pitch tolerance is available.
  • No chipping processing prevents chipping around the holes.

No chipping sandblasting

No chipping sandblasting

Conventional sandblasting

Conventional sandblasting

Ultrasonic-wave drilling

  • Collective hole drilling is available on a glass wafer of 4 mm thick max.
  • Simultaneous hole drilling is available on a glass wafer anodic-bonded to a silicon wafer.
Ultrasonic-wave drilling
Ultrasonic-wave drilling
Ultrasonic-wave drilling

Products processed by this technology

Micro-hole glass

Micro-hole glass

Spacer glass

Spacer glass

Special polishing

When polishing fragile materials with through-holes, a slope usually occurs around the edge of the hole. But it is possible to achieve a sharp edge around the holes with our special polishing.

Standard polishing

Standard polishing

Sagging size
Width > 400μm
Depth > 0.7μm

Special polishing (Tecni polishing)

Special polishing (Tecni polishing)

Sagging size
Width < 10.0μm
Depth < 0.1μm

Products processed by this technology

Through glass via (TGV)

Through glass via (TGV)

Micro-hole glass

Micro-hole glass

Microfluidic glass

Microfluidic glass

Cavity glass/Cap glass

Cavity glass/Cap glass

Spacer glass

Spacer glass

Mesh glass

Mesh glass

Transparent finish on the cavity bottom

Transparent finish is available on the bottom of the cavities of such glass as borosilicate glass, silica glass, etc. In the biotechnology/medical industries, the transparency makes it possible to observe inside from outside through the bottom of the cavities.

Transparent finish on the cavity bottom
Transparent finish on the cavity bottom
Transparent finish on the cavity bottom
Glass section

B size: 0.1 mm thick is available. A diameter of φ 200 mm max. is available.
If the bottom thickness (thickness B) is designated 0.1 - 0.15 mm, you can easily optimize focal distance on the immersion lens.

Transparent finish on the cavity bottom

Products processed by this technology

Through glass via (TGV)

Through glass via (TGV)

Microfluidic glass

Microfluidic glass

Cavity glass/Cap glass

Cavity glass/Cap glass

Mesh glass

Mesh glass

Microfluidic glass

Glass such as borosilicate glass and silica glass are applicable to this processing.
With sharp-edge channels with transparent bottom inside, these products have superior specifications of transparency, chemical resistance and heat resistance because they don’t contain such organic substance as adhesives.

Microfluidic glass with metal via
High-aspect microfluidic channel
Microfluidic glass

Products processed by this technology

Microfluidic glass

Microfluidic glass

Special technology

Lots of through holes as small as a square shape with 100 μm of each side can be formed on a hard glass wafer of four to six inch such as borosilicate glass wafer with high precision.
Thanks to the high precision, such products can be made by the special technology as a mesh glass with the holes plated for electrode, X-ray screen, filters for gas/liquid, and jigs for bump plating.

Special technology

Spacer glass

Products processed by this technology

Mesh glass

Mesh glass

Questions and inquiries

Questions and inquiries

Download catalogs