It is possible to machine cutting-resistant metals such as CuW, Kv, Ag, Mo or Cu. We are very good at technology of products from a square shape of 200 μm on a side to a few millimeters.
Our technologies include such processing as sharp edge, burring of less than a few μm, Ni/Au plating, AuSn vapor deposition and pattern metallization.
New-structured microchannel heat sink leading to a longer life of the high power LD module
Heat sink with high electric conductivity leading to the increase in the LD module power
Insulation type Cu-AlN-Cu submount
Cu-AlN-Cu composite-type submount with high thermal conductivity leading to the decrease in thermal stress to LD. Insulation type
High pressure Seamless microchannels
Original method of forming microchannels in single solid metal resulting in high pressure-resistance microchannels
Mounts / Carriers
With our “ Cross-edge ” technology, any type of carrier can be manufactured according to the customers’ requirements