Supports design and manufacturing with our "Cross-edge" technology

  1. 株式会社テクニスコ
  2. TECNISCO,LTD.
  3. About "Cross-edge" technology
  4. Bonding

Bonding

Microfluidic-structured heat sink

Standard processing to make channels inside the metal is to first process two parts separately and then bond them together by solder or thermal diffusion. However, our seamless microchannels are processed with our original manufacturing method, which results in a completely seamless structure without bonding layers. This enhances high-pressure resistance inside the channels. Minimum width of the microchannels is 20 μm.

厚み:0.9t Cu一体構造

厚み:0.9t Cu一体構造

Cu一体構造

Products processed by this technology

High pressure Seamless microchannels

High pressure Seamless microchannels

Assembled parts with metal and insulated ceramic by solder

It is possible to assemble each part with solder, which is processed by our micro machine processing and metallization.
Solder type: AuSn, AuGe, AgCu etc.

Mounts/carriers

Mounts/carriers

Mounts/carriers
Carriers for optical communication

Carriers for optical communication

Products processed by this technology

Mounts / Carriers

Mounts / Carriers

Cu-Mo-Cu forming into 1.6 mm thickness

Cu-Mo-Cu forming into 1.6 mm thickness

This product has seven-layer of Cu and Mo which are formed into a 1.6 mm thickness, leading to the control of CTE less than 8 ppm/K. The two technologies below are applied.

  • Three-layer forming of central Cu-Mo-Cu by electroforming
  • Seven-layer forming into the thickness with the three-layer above, bonded by AuSn solder
Cu-Mo-Cu forming into 1.6 mm thickness
Cu-Mo-Cu forming into 1.6 mm thickness
Cu-Mo-Cu forming into 1.6 mm thickness

With the technologies above, our customized microchannel cooler with LD-mounted on has achieved 5,000 hour endurance time in a continuous work test.

Cu-Mo-Cu forming into 1.6 mm thickness

We have optimized pressure distribution, turbulence kinetic energy distribution, and velocity distribution for our standard products by simulating various microchannels on a design stage. Those can be re-designed according to customers’ needs.

Products processed by this technology

Microchannel cooler

Microchannel cooler

Conductive-through-metal-via processing

This borosilicate glass wafer has a large number of through-conductive-metal-vias, which gives it electrical conductivity.
The maximum size of wafer is φ 200 mm. Anodic bonding can be applied to seal a silicon device.

Through glass via(φ0.3mm、10,296 vias)

Through glass via(φ0.3mm、10,296 vias)

Example applied for RF-MEMS switch
Example applied for RF-MEMS switch

Example applied for RF-MEMS switch

Products processed by this technology

Through glass via(TGV)

Through glass via(TGV)

Microfluidic glass

Microfluidic glass

Anodic bonding of glass to silicon

Anodic bonding is the bonding method where heat and voltage are applied to the borosilicate glass and silicon. It can achieve high-quality bonding because adhesive or solder is not used in the process.

Anodic bonding of glass to silicon
Anodic bonding of glass to silicon
Anodic bonding of glass to silicon

Products processed by this technology

Through glass via(TGV)

Through glass via(TGV)

Mesh glass

Mesh glass

Micro-hole glass

Micro-hole glass

Microfluidic glass

Microfluidic glass

Questions and inquiries

Questions and inquiries

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