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  1. 株式会社テクニスコ
  2. TECNISCO,LTD.
  3. Product
  4. Metal products
  5. CuW submounts

CuW submounts

Outline

This CuW submount is used as a heat sink for high power LD modules. Alignment with LD, and sharp edge and control of warpage for effective thermal conductivity are available.
Redundant solder can be controlled in AuSn vapor deposition on the LD bonding area.

CuW submounts

Features

Materials

Composition W90/Cu10
Thermal conductivity 170W/m・K
CTE (coefficient of thermal expansion) 6.5ppm/℃

Dimension/Tolerance

Length Refer to the right table
Width
Thickness
Surface roughness Ra<0.4
Warpage 5.0μm以下
Edge radius 20.0μm以下

Metallization

All surface Ni 1.0-5.0μm/Au 0.1-0.3μm

AuSn solder

Composition Au75/Sn25(wt%)
Thickness 5μm ±1μm
CuW submounts
Enlarged view

Enlarged view

Options

Material selection(W80 / Cu20)

Sputtering layer(Ti, Pt, Au etc.)

Additional structure (Hole, Step)

Note: These are standard specifications.
In case you have any request other than the above, please feel free to contact us

Standard specifications(Unit:mm)

Options
Length(±0.05) Width(±0.05) Thickness(±0.02)
10.6 2.0 0.20
0.25
0.30
0.40
3.0
4.0
5.6 5.6

End user market / Applications

Industrial laser

  • Laser equipment for welding, cutting, marking,
    surface treatment(e.g. annealing), etc
  • Medical laser equipment for ophthalmology and epilation, and endoscopes,etc

Semiconductors

  • Power semiconductor devices, MPU (Microprocessing units),etc

Digital equipment

  • Laser printers, Digital multifunction-printers,etc

Questions and inquiries

Questions and inquiries

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