CuW submounts
Outline
This CuW submount is used as a heat sink for high power LD modules. Alignment with LD, and sharp edge and control of warpage for effective thermal conductivity are available.
Redundant solder can be controlled in AuSn vapor deposition on the LD bonding area.
Features
Materials
| Composition | W90/Cu10 |
| Thermal conductivity | 170W/m・K |
| CTE (coefficient of thermal expansion) | 6.5ppm/℃ |
Dimension/Tolerance
| Length | Refer to the right table |
| Width | |
| Thickness | |
| Surface roughness | Ra <0.4 |
| Warpage | 5.0μm ≦ |
| Edge radius | 20.0μm ≦ |
Metallization
| All surface | Ni 1.0-5.0μm/Au 0.1-0.3μm |
AuSn solder
| Composition | Au75/Sn25(wt%) |
| Thickness | 5μm ±1μm |
Enlarged view
Options
Material selection（W80 / Cu20）
Sputtering layer（Ti, Pt, Au etc.)
Additional structure (Hole, Step)
Note: These are standard specifications.
In case you have any request other than the above, please feel free to contact us
Standard specifications（Unit：mm）
| Length（±0.05） | Width（±0.05） | Thickness（±0.02） |
|---|---|---|
| 10.6 | 2.0 | 0.20 0.25 0.30 0.40 |
| 3.0 | ||
| 4.0 | ||
| 5.6 | 5.6 |
End user market / Applications
Industrial laser
- Laser equipment for welding, cutting, marking,
surface treatment(e.g. annealing), etc - Medical laser equipment for ophthalmology and epilation, and endoscopes,etc
Semiconductors
- Power semiconductor devices, MPU (Microprocessing units),etc
Digital equipment
- Laser printers, Digital multifunction-printers,etc