Microchannel cooler
Outline
Joint program with Fraunhofer ILT (Germany) leads to the development of new-structured microchannel heat sink which gives the high power LD module a longer life. Complement effect between Cu and Mo and technology of inside channels make it low electric-resistant and CTE-matched with LD. Au coating on the inside of the channels results in the improvement in corrosion prevention.
Features
Realize higher power and longer life of the LD module
Possible to mount 120 W class LD
Realize CTE
(coefficient of thermal expansion) 8ppm/℃
- Possible to mount LD directly on microchannel cooler without a submount
Realize longer life of the LD module
- CTE matching on the LD mounting area
- Complete Au coating on inside of the channel for preventing corrosion
AuSn solder deposition on the LD mounting area
Joint development with Fraunhofer ILT (Germany)
CTE matching structure Cross section
(CTE is controlled by Cu-Mo-Cu 7 layers)
Options
Material selection: Cu-W-Cu or Cu
(In case of Cu made MCC, a submount is required)
Diamond turning process is available
Note: Patented in Japan, U.S. and EPC.
Fluid simulation
Evaluation features of standard specification
| Feature | Remarks | |
|---|---|---|
| TC | Approx. 0.5℃/W | 500ml/min |
| Flow rate | Approx. 500ml/min | 150kPa |
| Warpage | <1μm | LD mounting area |
| Size | 11.0×20.0×1.55t(mm) | Single type |
| 11.0×27.0×1.55t(mm) | Stack type |
End user market / Applications
Industrial laser
- Laser equipment for welding, cutting, marking, surface treatment(e.g. annealing), etc
- Medical laser equipment for ophthalmology and epilation, and endoscopes,etc