Insulation type Cu-AlN-Cu submounts
Outline
This is a heat sink for high-power LD (Laser diode) modules. Three-layer composition achieves both high thermal conductivity and insulation quality. Control of Cu plating thickness makes the heat sink match with the LD, resulting in higher power and longer life of the LD module. Because pullback is not required on the critical edge area, it has a high degree of freedom in designing. Moreover, it can be applied to a variety of application by this freedom in design.
Features
AlN + Cu composite material to achieve higher thermal conductivity and insulation quality
CTE (coefficient of thermal expansion) matching with the LD (Laser diode)
- Adjusting Cu and AlN thickness makes it possible to control CTE
Ideal for multi-emitting type LD
Pullback is not required on the critical edge area
- Ideal for P side down type LD
AuSn/AuGe solder vapor deposition
Easy alignment with LD on the sharp edge
- Edge radius less than 20 μm
Characteristics comparison data<Reference>
※Please scroll to the side.
| Unit | Cu-AlN-Cu | AlN | CuW（10/20） | |
|---|---|---|---|---|
| Material features | − | Insulation | Insulation | Conductive |
| Thermal conductivity | W/m・K | 190〜250※ | 170 | 180/200 |
| CTE | ppm/℃ | 6〜10※ | 4.6 | 6.5/8.3 |
| Electric-resistance | Ω・m | - | - | 5.3/4.0 (×10-8) |
| Work voltage | V | <200 | <200 | NA |
| Relative permittivity (@1 MHz) | - | 9 | 9 | NA |
| Dissipation factor (Tan δ ） | - | 5×10-4 | 5×10-4 | NA |
※Controllable by design
End user market / Applications
Industrial laser
- Laser equipment for welding, cutting, marking,
surface treatment(e.g. annealing), etc - Medical laser equipment for ophthalmology and epilation, and endoscopes,etc
Semiconductors
- Medical laser equipment for ophthalmology and epilation, and endoscopes,etc
Digital equipment
- Laser printers, Digital multifunction-printers,etc