Suitable for multilayer packaging by combining with semiconductor wafers such as MEMS devices.
Improve bonding yield with device wafers
Control sagging around the holes
Minimize chipping size
- ≦10μm is available
Remove microcracks from machined surface to control the particles
- Prevent malfunctions in bonding with MEMS devices
※Please scroll to the side.
|Min. hole size||φ0.3mm|
|Window shape||upon request|
|Window size tolerance||±0.02mm|
|Cross-section shape||Straight / Taper / Step|
Note: These are standard specifications.
In case you have any request other than these, please feel free to contact us.
End user market / Applications
- Display devices for projectors,etc
- RF-MEMS switches.
- Image sensors,etc
- RF-switches/relays for mobile devices such as smartphones, portable video games, digital cameras, car navigation systems,
- Pressure sensors, Acceleration sensors.
- Analytical chips for DNA/drug-discovery-screening analyzers,etc
- Microreactors for biochemical reaction/electrophoresis analyzers,etc
- Bioreactors for chemical sensors, microorganism-detection sensors,etc
- Industrial gas-detection sensors,etc