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Micro-hole glass


Micro-hole glass
Micro-hole glass

Anodic bonding with a silicon wafer can result in solving the out-gas issue. It can be used in the wafer-level-packaging (WLP) process.


Micro-hole processing

  • min. size φ0.1mm

Max. glass size φ300 mm

(Some processes are only available up to ø200 mm wafer max.)

Improve bonding yield of device wafers

Suppress sagging around the holes

Minimize chipping size

  • ≦10μm is available

※Please scroll to the side.

Standard specifications
Material Glass
Glass size ≦φ300mm(*)
Min. thickness 0.15mm
Thickness tolerance ±0.01mm
Min. hole size φ0.1mm
Hole shape upon request
Hole size tolerance ±0.02mm
Chipping ≦100μm
Cross section shape Straight / Taper / Step
Metallization process Available

Note: These are standard specifications.
In case you have any request except for this, please feel free to contact us.

Sagging comparison

Sharp edge type

Sharp edge type
Sagging size
Width <10μm
Depth <0.1μm

Standard type

Standard type
Sagging size
Width >400μm
Depth >0.7μm

Chipping comparison

Less-chipping type

Less-chipping type

Standard type

Standard type

End user market / Applications


  • Pressure sensors, Acceleration sensors.
  • Gyroscopes,etc


  • RF-MEMS switches.
  • Image sensors,etc

Questions and inquiries

Questions and inquiries

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