Mesh glass
Outline
Quadrangular hole without rounded corners which was impossible before. Small-hole and narrow-pitch processing are available.
Features
High aspect ratio on the micro through holes
Multiple holes on 6-inch wafer
- （ex.）e.g. 150,000 of 0.1×0.1 mm holes on a 3-inch wafer
High aspect through holes from 1:8 to 1:10
- Straight or taper holes are possible
Minimize chipping size
- Improve anodic bonding performance
Options
Sidewall metallization
- Protect light interference /absorption between holes
Cavity type is selectable
※Please scroll to the side.
| Standard specifications | |
|---|---|
| Material | Borofloat 33 etc. |
| Glass size | ≦φ150mm |
| Min. thickness | 0.25mm |
| Thickness tolerance | ±0.01mm |
| Min. hole size | □0.07mm |
| Hole size tolerance | ±0.02mm |
| Max. aspect ratio | 1 : 10 |
| Particle control | Available |
| Cross-section shape | Straight / Taper |
Note: These are standard specifications.
In case you have any request other than these, please feel free to contact us.