Quadrangular hole without rounded corners which was impossible before. Small-hole and narrow-pitch processing are available.
High aspect ratio on the micro through holes
Multiple holes on 6-inch wafer
- （ex.）e.g. 150,000 of 0.1×0.1 mm holes on a 3-inch wafer
High aspect through holes from 1:8 to 1:10
- Straight or taper holes are possible
Minimize chipping size
- Improve anodic bonding performance
- Protect light interference /absorption between holes
Cavity type is selectable
※Please scroll to the side.
|Material||Borofloat 33 etc.|
|Min. hole size||□0.07mm|
|Hole size tolerance||±0.02mm|
|Max. aspect ratio||1 : 10|
|Cross-section shape||Straight / Taper|
Note: These are standard specifications.
In case you have any request other than these, please feel free to contact us.