3D Glass Mettalization
Features
Form a wiring on the three-dimensional shape is available for downsizing, weight reducing to achieve high performance of electronics
Standard Specification
| Material | Glass |
| Wafer Size | Up to Dia. 200mm |
| Wafer Thickness | 0.3 to 2.0mm |
| Cavity Depth | Up to 0.5mm |
| Thickness Tolerance | ±0.02mm |
| Metallization Type | Ti/Cr/Pt/Au |
Minimum Line / Space
Linewidth 40 μm / Pitch 70 μm