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  1. 株式会社テクニスコ
  2. TECNISCO,LTD.
  3. About "Cross-edge" technology
  4. 3D Glass Mettalization

3D Glass Mettalization

Features

電子部品の小型軽量化、高性能化に伴い、凹凸のある形状に メタル配線を形成することが可能になりました

Form a wiring on the three-dimensional shape is available for downsizing, weight reducing to achieve high performance of electronics

Standard Specification

3D配線基板
Materia Glass
Wafer Size Up to Dia. 200mm
Wafer Thickness 0.3 to 2.0mm
Cavity Depth Up to 0.5mm
Thickness Tolerance ±0.02mm
Metallization Type Ti/Cr/Pt/Au

Minimum Line / Space

 

配線幅40um

Linewidth 40 μm / Pitch 70 μm

Questions and inquiries

Questions and inquiries

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