Supports design and manufacturing with our "Cross-edge" technology

  1. 株式会社テクニスコ
  2. TECNISCO,LTD.
  3. About "Cross-edge" technology
  4. HY Method

HY Method

Features

メッシュガラス

 

Micro rectangle through holes with Mesh glass

Mesh glass

メッシュガラス
メッシュガラス
メッシュガラス

Standard Specifications

Material Glass
Wafer Size Up to Dia. 150mm
Wafer Thickness 0.1mm
Hole Shape Rectangle
Min. Hole Size □30um
Size Tolerance ±0.01mm~

Questions and inquiries

Questions and inquiries

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