Supports design and manufacturing with our "Cross-edge" technology

  1. 株式会社テクニスコ
  2. TECNISCO,LTD.
  3. About "Cross-edge" technology
  4. Si + Glass wafer

Si + Glass wafer

Features

Si+Glass一体基板
  • Glass area has mirror finished surface
  • Transmittance is same as original Borofloat 33
  • Possible to use as insulating and/or light sheild material

Standard Specifications

Si+Glass一体基板
Si+Glass一体基板
Material TEMPAX
Wafer Size ~200mm
Wafer thickness 0.3~2.0mm
Flatness < 0.1mm(8inch)
TTV < 0.01mm
Material Gap < 0.1um

Questions and inquiries

Questions and inquiries

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