TGV (Cu-Via)
Features
- TGV with filled Cu makes it possible to minimize device
- Glass surface has mirror finished quality and transmittance is same as original Borofloat 33
Standard Specifications
【Ｘ型めっき】Open via diameter 60um
| Material | Glass |
| Wafer Size | Up to200mm |
| Wafer thickness | Up to 0.5mm |
| Flatness | ＜ 0.1mm（8inch） |
| Via Size | 0.05~0.3mm |
| Material Gap (Glass to Via) | ＜ 0.1um |