EVENTS

IC & SENSOR PACKAGING EXPO (Jan. 21-23, 2026)

2026/01/09

English

TECNISCO participates in IC & SENSOR PACKAGING EXPO (40th NEPCPN JAPAN).
We are looking forward to seeing you there!

Dates	January 21th[Wed.] - 23th[Fri.],2026 　 10:00 AM - 5:00 PM
Venue	Tokyo Big Sight, Japan 　East Hall 7, Booth: E32-52

For more information, please refer to IC & SENSOR PACKAGING EXPO (40th NEPCPN JAPAN) Website.

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