IC & SENSOR PACKAGING EXPO (2025/１/22 - 24) 出展通知。
IC & SENSOR PACKAGING EXPO (39th NEPCPN JAPAN)
TECNISCO participates in IC & SENSOR PACKAGING EXPO (39th NEPCPN JAPAN).
We are looking forward to seeing you there!
| Dates | 2025年1月22日(星期三) - 1月24日(星期五) 10:00-17:00 |
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| Venue | Tokyo Big Sight, Japan East Hall 7, Booth: E65-52 |
For more information, please refer to IC & SENSOR PACKAGING EXPO (39th NEPCPN JAPAN)Website.
