IC & SENSOR PACKAGING EXPO (Jan. 22-24, 2025)

IC & SENSOR PACKAGING EXPO (39th NEPCPN JAPAN)
TECNISCO participates in IC & SENSOR PACKAGING EXPO (39th NEPCPN JAPAN).
We are looking forward to seeing you there!
Dates | January 22 [Wed.] - 24 [Fri.],2025 10:00-17:00 |
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Venue | Tokyo Big Sight, Japan East Hall 7, Booth: E65-52 |
For more information, please refer to IC & SENSOR PACKAGING EXPO (39th NEPCPN JAPAN) Website.