IC & SENSOR PACKAGING TECHNOLOGY EXPO 2022 (January 19-21, 2022)
IC & SENSOR PACKAGING TECHNOLOGY EXPO 2022
TECNISCO participates in IC & SENSOR PACKAGING TECHNOLOGY EXPO 2022.
Drop by our site to get to know our new technologies!
| Dates | IC & SENSOR PACKAGING TECHNOLOGY EXPO 2022 dates: January 19 (Wed) - 21 (Fri), 2022 |
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| Venue | Our booth information : Tokyo Big Sight, Japan East Hall 3, booth 25-24 |
For more information, please refer to the IC & SENSOR PACKAGING TECHNOLOGY EXPO 2022 Website.
ISP - IC & Sensor Packaging Technology EXPO (nepconjapan.jp)
