21th IC & SENSOR PACKAGING TECHNOLOGY EXPO (1/15-1/17) 出展产品。
21th IC & SENSOR PACKAGING TECHNOLOGY EXPO
TECNISCO participates in 21th IC & SENSOR PACKAGING TECHNOLOGY EXPO
We will be looking forward to seeing you there!
| Dates | January 15[Wed] - 17[Fri], 2020 10:00-18:00 (last day until 17:00) |
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| Venue | Tokyo Big Sight , Japan Booth Location WEST 2HALL W9-40 |
For more information, please refer to the 21th IC & SENSOR PACKAGING TECHNOLOGY EXPO Website.
