IC & SENSOR PACKAGING EXPO(ISP) (2023/１/25 - 27) 出展通知。
IC & SENSOR PACKAGING EXPO (ISP)
TECNISCO participates in IC & SENSOR PACKAGING EXPO(ISP).
We are looking forward to seeing you there!
| Dates | January 25 [Wed.] - 27 [Fri.], 2023 10:00-17:00 |
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| Venue | Tokyo Big Sight, Japan East Hall 3, Booth: 26-20 |
For more information, please refer to IC & SENSOR PACKAGING EXPO(ISP) Website.
